Microwave measurements for planar circuits and components

• Research unit: SERI
• Project number: 15.0239

Abstract (English)

High-frequency microchips (or integrated circuits) are in widespread use and are a key enabling technology in systems that employ micro- and nano-electronics such as mobile communications and radar sensors in driverless cars. Increasing demands for higher data rates, and the development of high-resolution radar imaging, are continually pushing up the operating frequency of these systems. Accurate and traceable measurements of such high-frequency integrated circuits are essential for system developments, providing confidence and lowering costs in industry. However, the uncertainties associated with currently available measurement procedures become more pronounced at high frequencies. This project will enable the traceable measurement and characterisation of integrated circuits and components from radio-frequency to sub-mm frequencies with known measurement uncertainties. This will allow industry to develop components and devices in high-speed and microwave applications, such as wireless communications, automotive radar and medical sensing.