Impulse ATOM Assembly TechnOlogy for MEMS

• Unité de recherche: INNOSUISSE
• Numéro de projet: 37572.1 IP-ENG
• Titre du projet anglais: Impulse ATOM Assembly TechnOlogy for MEMS

Description succincte (Allemand)

Impulse ATOM Assembly TechnOlogy for MEMS

Description succincte (Anglais)

ATOM Assembly TechnOlogy for MEMS

Résumé des résultats (Abstract) (Allemand)

Sy&Se startup, with the support of HE-Arc (automation) and EMPA (material analysis expertise), will improve the Impulse Current Bonding technology (ICB), Industry 4.0 oriented, and apply it on MEMS sensors manufactured by TE Connectivity Solutions company to improve the product design and process.