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Research unit
INNOSUISSE
Project number
37572.1 IP-ENG
Project title
Impulse ATOM Assembly TechnOlogy for MEMS

Texts for this project
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Short description
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Abstract
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CategoryText
Short description
(German)
Impulse ATOM Assembly TechnOlogy for MEMS
Short description
(English)
ATOM Assembly TechnOlogy for MEMS
Abstract
(German)
Sy&Se startup, with the support of HE-Arc (automation) and EMPA (material analysis expertise), will improve the Impulse Current Bonding technology (ICB), Industry 4.0 oriented, and apply it on MEMS sensors manufactured by TE Connectivity Solutions company to improve the product design and process.