Backside replicated, folded (90-degree) micro-optical connectivity to wafer-scale lens arrays (BASIMO)

• Unité de recherche: INNOSUISSE
• Numéro de projet: 27659.1 PFNM-NM
• Titre du projet anglais: Backside replicated, folded (90-degree) micro-optical connectivity to wafer-scale lens arrays (BASIMO)

Description succincte (Allemand)

Backside replicated, folded (90-degree) micro-optical connectivity to wafer-scale lens arrays (BASIMO)

Description succincte (Anglais)

Backside replicated, folded (90-degree) micro-optical connectivity to wafer-scale lens arrays (BASIMO)

Résumé des résultats (Abstract) (Allemand)

This project focuses on the demonstration of the feasibility of innovative folded (90-degree), monolithically integrated, wafer level, micro-optical connectivity solutions to provide advantages when limited space is available.

Résumé des résultats (Abstract) (Anglais)

This project focuses on the demonstration of the feasibility of innovative folded (90-degree), monolithically integrated, wafer level, micro-optical connectivity solutions to provide advantages when limited space is available.