Backside replicated, folded (90-degree) micro-optical connectivity to wafer-scale lens arrays (BASIMO) - Texts

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Research unit

INNOSUISSE

Project number

27659.1 PFNM-NM

Project title

Backside replicated, folded (90-degree) micro-optical connectivity to wafer-scale lens arrays (BASIMO)

Texts for this project

	German	French	Italian	English
Short description		-	-
Abstract		-	-

Inserted texts

Category	Text
Short description (German)	Backside replicated, folded (90-degree) micro-optical connectivity to wafer-scale lens arrays (BASIMO)
Short description (English)	Backside replicated, folded (90-degree) micro-optical connectivity to wafer-scale lens arrays (BASIMO)
Abstract (German)	This project focuses on the demonstration of the feasibility of innovative folded (90-degree), monolithically integrated, wafer level, micro-optical connectivity solutions to provide advantages when limited space is available.
Abstract (English)	This project focuses on the demonstration of the feasibility of innovative folded (90-degree), monolithically integrated, wafer level, micro-optical connectivity solutions to provide advantages when limited space is available.