Backside replicated, folded (90-degree) micro-optical connectivity to wafer-scale lens arrays (BASIMO)

Forschungsstelle

INNOSUISSE

Projektnummer

27659.1 PFNM-NM

Projekttitel

Backside replicated, folded (90-degree) micro-optical connectivity to wafer-scale lens arrays (BASIMO)

Projekttitel Englisch

Backside replicated, folded (90-degree) micro-optical connectivity to wafer-scale lens arrays (BASIMO)

Texte zu diesem Projekt

	Deutsch	Französisch	Italienisch	Englisch
Kurzbeschreibung		-	-
Abstract		-	-

Kategorie	Text
Kurzbeschreibung (Deutsch)	Backside replicated, folded (90-degree) micro-optical connectivity to wafer-scale lens arrays (BASIMO)
Kurzbeschreibung (Englisch)	Backside replicated, folded (90-degree) micro-optical connectivity to wafer-scale lens arrays (BASIMO)
Abstract (Deutsch)	This project focuses on the demonstration of the feasibility of innovative folded (90-degree), monolithically integrated, wafer level, micro-optical connectivity solutions to provide advantages when limited space is available.
Abstract (Englisch)	This project focuses on the demonstration of the feasibility of innovative folded (90-degree), monolithically integrated, wafer level, micro-optical connectivity solutions to provide advantages when limited space is available.