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Forschungsstelle
METAS
Projektnummer
F-5217.30084
Projekttitel
16ENG06 ADVENT: Metrology for advanced energy-saving technology in next-generation electronics applications

Texte zu diesem Projekt

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Schlüsselwörter
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Kurzbeschreibung
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Projektziele
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Abstract
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Umsetzung und Anwendungen
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Publikationen / Ergebnisse
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Erfasste Texte


KategorieText
Schlüsselwörter
(Englisch)
Next-generation electronics; telecommunications; electronic power consumption, ultra-low power; high frequency electronics; Nano material characterization; energy efficient materials and devices.
Kurzbeschreibung
(Englisch)

The roll-out of 5th Generation (5G) telecommunications across Europe by the year 2020, and the emergence of the Internet of Things (IoT) with 50 billion connected devices, will strongly increase the demand for energy due to the continuous power consumption of the electronic devices needed to deliver these technologies, leading to an associated demand for more energy-efficient systems. This project establishes the metrology required for this transformational objective for Europe by providing traceable measurements of power, losses and emerging electronic materials properties. Thus this project will enable European industries to optimise device and systems design for 5G and IoT applications requiring ultra-low power and more energy efficient operation.

The ongoing IoT and the future 5G radio access network will have a fundamental impact on the daily life of all European citizens. Sensors (the cornerstone of IoT) will be found everywhere (car, house, industrial health monitoring, etc.) and 5G communication systems will provide greater connectivity (Machine-to-Machine, high data rates with low latency). The high data-rate aspect of 5G at mmWave frequencies makes the power consumption and thermal issues very challenging in wireless devices. By 2020, the Information and Communications Technology (ICT) sector is expected to contribute about 2 % of global CO2 emissions instead of 1.3 % in 2007 (Ericsson report, 2010). Within this, 20 % of the footprint may be attributed to personal mobile networks and mobile devices. Phones and tablets will produce the strongest percentage increase in the ICT’s footprint: recent estimations forecast 50 billion devices enhancing the footprint by a factor of 4.
Improvement of the energy efficiency of devices and processes is therefore a key component for sustainable development of European products. Due to restrictions in current scaling strategies and dramatic thermal issues (particularly in wireless systems), semiconductor and electronics manufacturing roadmaps are aimed at the introduction of novel materials, more complete component characterisation and more efficient power management at the system level that will lead to the development of novel ultra-low power devices. To support industry in facing these challenging issues, traceable measurement techniques are required that will establish a robust metrology framework for in-situ, in-operando and multiphysics characterisation of advanced materials and components, and for reliable and accurate data for an efficient power management system.

This is a joint research project carried out in the framework of the European Metrology Programme for Innovation and Research (EMPIR) (see:http://www.euramet.org/research-innovation/empir/). The EMPIR initiative is co-funded by the European Unions's Horizon 2020 research and innovation programme and the participating states. METAS is one of the project partners in the Project.

Projektziele
(Englisch)

The specific objectives of the project are:

  1. To develop nanometrology adapted to the in-situ and in-operando characterisation of advanced new materials proposed for the next generation of ultra-low power energy-efficient devices. These measurements will include impedance measurements (capacitance, resistance and inductance), piezo-electric/piezoresistive stress (200 MPa) and strain (0.02 %) responses to the application of electric (up to 4 MV/cm) and magnetic (up to 2 T) fields, as well as temperature and pressure in the range encountered in electronic devices.
  2. To develop frequency and time-domain techniques for the simultaneous measurement of dynamic thermal profiles, electro-magnetic field sensing, DC electrical power consumption and RF operating waveforms for a wide range of RF electronic components (operating in-situ, under realistic conditions). These techniques to be combined with a multi-physics approach, which will establish rigorous energy budgets, and diagnostic capabilities, for a wide range of electronic components (operating in-situ, under realistic conditions), required for next-generation communications. The uncertainty in the measurement of the power efficiency to be reduced to less than 1 %.
  3. To develop embedded sensors and the associated calibration and measurement techniques to accurately measure power consumption of wireless systems (mobile phones, tablets and connected devices) and to improve the effectiveness of analogue and RF tests of components and systems. The power measurement techniques will be able to characterise and calibrate on-chip power sensors with an uncertainty of less than 10 μW.
  4. To facilitate the take up of the technology and measurement infrastructure developed in the project by the measurement supply chain (accredited laboratories), standards developing organisations (ISO) and end users (the semiconductor industry, and the telecommunications sector).
Abstract
(Englisch)
This project dealt with the development of metrological tools for energy-efficient electronic materials, devices and systems with extremely low power and high frequency. At the technical level, METAS participated in the production of impedance standards for Scanning Microwave Microscope (SMM) measurements and the characterization measurements of piezo materials and GaN structures with the SMM.
Umsetzung und Anwendungen
(Englisch)
The experience obtained in the design and production of impedance standards will be used to develop the next generation of impedance standards for coaxial SMM probes. 
The experience gained in the characterization of samples produced with thin film technology with the SMM opens up new possibilities to characterize materials in future applications.
Publikationen / Ergebnisse
(Englisch)
  1. T. L. Quang, D. Vasyukov, J. Hoffmann, A. Buchter, and M. Zeier. Fabrication and measurements of inductive devices for scanning microwave microscopy. In 2019 IEEE 19th International Conference on Nanotechnology (IEEE-NANO), pages 429–432, 2019
  2. T. L. Quang, D. Vasyukov, J. Hoffmann, A. Buchter, and M. Zeier. Comsol Simula-tions for Scanning Microwave Microscopy, Comsol Conference, 2018. https://www.comsol.ch/paper/comsol-simulation-for-scanning-microwave-microscopic-experiments-64741 
  3. T. L. Quang, et al., Advanced Calibration Kit for Scanning Microwave Microscope: Design, Fabrication and Measurement, submitted to Rev. Sci. Instrum.
  4. M. Olszewska-Placha, M.Celuch, T. Le Quang, A. Gungor, J. Hoffmann, J. Smajic, J. Rudnicki, "Open access CAD, EM tools, and examples for teaching microwaves", ac-cepted for 23rd Intl. Conference on Microwaves, Radar and Wireless Communications MIKON-2020, Warsaw, 5-8 October 2020.