NanoCleave # Cleavage of lasers with atomic flat cleavage planes down to component sizes of 200 µm

• Unité de recherche: INNOSUISSE
• Numéro de projet: 27427.1 PFNM-NM

Description succincte (Allemand)

NanoCleave # Cleavage of lasers with atomic flat cleavage planes down to component sizes of 200 µm

Résumé des résultats (Abstract) (Allemand)

The aim is to improve semiconductor cleavage to fabricate laser parts with a length of 200µm. This will open a new market for high capacity hard disks. The mechanisms governing crack propagation at small length scales will be revealed by combining micro-fracture experiments and simulations.