NanoCleave # Cleavage of lasers with atomic flat cleavage planes down to component sizes of 200 µm

• Research unit: INNOSUISSE
• Project number: 27427.1 PFNM-NM

Short description (German)

NanoCleave # Cleavage of lasers with atomic flat cleavage planes down to component sizes of 200 µm

Abstract (German)

The aim is to improve semiconductor cleavage to fabricate laser parts with a length of 200µm. This will open a new market for high capacity hard disks. The mechanisms governing crack propagation at small length scales will be revealed by combining micro-fracture experiments and simulations.