NanoCleave # Cleavage of lasers with atomic flat cleavage planes down to component sizes of 200 µm

Forschungsstelle

INNOSUISSE

Projektnummer

27427.1 PFNM-NM

Projekttitel

NanoCleave # Cleavage of lasers with atomic flat cleavage planes down to component sizes of 200 µm

Texte zu diesem Projekt

	Deutsch	Französisch	Italienisch	Englisch
Kurzbeschreibung		-	-	-
Abstract		-	-	-

Kategorie	Text
Kurzbeschreibung (Deutsch)	NanoCleave # Cleavage of lasers with atomic flat cleavage planes down to component sizes of 200 µm
Abstract (Deutsch)	The aim is to improve semiconductor cleavage to fabricate laser parts with a length of 200µm. This will open a new market for high capacity hard disks. The mechanisms governing crack propagation at small length scales will be revealed by combining micro-fracture experiments and simulations.