PicoFlex: Development of free formation high energy beam cutting system of smart substrates for sub 7-inch mobile electronic devices

• Unité de recherche: INNOSUISSE
• Numéro de projet: 25326.1 PFNM-NM
• Titre du projet anglais: PicoFlex: Development of free formation high energy beam cutting system of smart substrates for sub 7-inch mobile electronic devices

Description succincte (Allemand)

PicoFlex: Development of free formation high energy beam cutting system of smart substrates for sub 7-inch mobile electronic devices

Description succincte (Anglais)

PicoFlex: Development of free formation high energy beam cutting system of smart substrates for sub 7-inch mobile electronic devices

Résumé des résultats (Abstract) (Allemand)

In this project a flexible pulse delivery system for a materials processing system based on an optical fiber will be developed.

Résumé des résultats (Abstract) (Anglais)