PicoFlex: Development of free formation high energy beam cutting system of smart substrates for sub 7-inch mobile electronic devices

Research unit

INNOSUISSE

Project number

25326.1 PFNM-NM

Project title

PicoFlex: Development of free formation high energy beam cutting system of smart substrates for sub 7-inch mobile electronic devices

Texts for this project

	German	French	Italian	English
Short description		-	-
Abstract		-	-

Category	Text
Short description (German)	PicoFlex: Development of free formation high energy beam cutting system of smart substrates for sub 7-inch mobile electronic devices
Short description (English)	PicoFlex: Development of free formation high energy beam cutting system of smart substrates for sub 7-inch mobile electronic devices
Abstract (German)	In this project a flexible pulse delivery system for a materials processing system based on an optical fiber will be developed.
Abstract (English)