PicoFlex: Development of free formation high energy beam cutting system of smart substrates for sub 7-inch mobile electronic devices

• Forschungsstelle: INNOSUISSE
• Projektnummer: 25326.1 PFNM-NM
• Projekttitel Englisch: PicoFlex: Development of free formation high energy beam cutting system of smart substrates for sub 7-inch mobile electronic devices

Kurzbeschreibung (Deutsch)

PicoFlex: Development of free formation high energy beam cutting system of smart substrates for sub 7-inch mobile electronic devices

Kurzbeschreibung (Englisch)

PicoFlex: Development of free formation high energy beam cutting system of smart substrates for sub 7-inch mobile electronic devices

Abstract (Deutsch)

In this project a flexible pulse delivery system for a materials processing system based on an optical fiber will be developed.

Abstract (Englisch)