Development of Abrasive Blades for Wafer Dicing by Using Ceramic Tape Casting Technology (AbraCas)

• Unité de recherche: INNOSUISSE
• Numéro de projet: 25133.2 PFNM-NM
• Titre du projet anglais: Development of Abrasive Blades for Wafer Dicing by Using Ceramic Tape Casting Technology (AbraCas)

Description succincte (Allemand)

Development of Abrasive Blades for Wafer Dicing by Using Ceramic Tape Casting Technology

Description succincte (Anglais)

Development of Abrasive Blades for Wafer Dicing by Using Ceramic Tape Casting Technology (AbraCas)

Résumé des résultats (Abstract) (Allemand)

Meister Abrasives AG and ZHAW intend to develop a completely new process for the production of dicing blades for wafers used in high tech industries (semiconductors, MEMS). With the new process based on ceramic tape casting technology adapted to vitreous bonded diamond abrasives limitations of the current production process will be overcome. It will lead to thinner blades with controlled and tailorable microstructure using vitreous bond systems.

Résumé des résultats (Abstract) (Anglais)