Development of Abrasive Blades for Wafer Dicing by Using Ceramic Tape Casting Technology (AbraCas) - Texts

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Research unit

INNOSUISSE

Project number

25133.2 PFNM-NM

Project title

Development of Abrasive Blades for Wafer Dicing by Using Ceramic Tape Casting Technology (AbraCas)

Texts for this project

	German	French	Italian	English
Short description		-	-
Abstract		-	-

Inserted texts

Category	Text
Short description (German)	Development of Abrasive Blades for Wafer Dicing by Using Ceramic Tape Casting Technology
Short description (English)	Development of Abrasive Blades for Wafer Dicing by Using Ceramic Tape Casting Technology (AbraCas)
Abstract (German)	Meister Abrasives AG and ZHAW intend to develop a completely new process for the production of dicing blades for wafers used in high tech industries (semiconductors, MEMS). With the new process based on ceramic tape casting technology adapted to vitreous bonded diamond abrasives limitations of the current production process will be overcome. It will lead to thinner blades with controlled and tailorable microstructure using vitreous bond systems.
Abstract (English)