Development of Abrasive Blades for Wafer Dicing by Using Ceramic Tape Casting Technology

Forschungsstelle

INNOSUISSE

Projektnummer

25133.2 PFNM-NM

Projekttitel

Development of Abrasive Blades for Wafer Dicing by Using Ceramic Tape Casting Technology

Projekttitel Englisch

Development of Abrasive Blades for Wafer Dicing by Using Ceramic Tape Casting Technology (AbraCas)

Texte zu diesem Projekt

	Deutsch	Französisch	Italienisch	Englisch
Kurzbeschreibung		-	-
Abstract		-	-

Kategorie	Text
Kurzbeschreibung (Deutsch)	Development of Abrasive Blades for Wafer Dicing by Using Ceramic Tape Casting Technology
Kurzbeschreibung (Englisch)	Development of Abrasive Blades for Wafer Dicing by Using Ceramic Tape Casting Technology (AbraCas)
Abstract (Deutsch)	Meister Abrasives AG and ZHAW intend to develop a completely new process for the production of dicing blades for wafers used in high tech industries (semiconductors, MEMS). With the new process based on ceramic tape casting technology adapted to vitreous bonded diamond abrasives limitations of the current production process will be overcome. It will lead to thinner blades with controlled and tailorable microstructure using vitreous bond systems.
Abstract (Englisch)