HiPerCon: Superior thermal underfill with hierarchical percolating particle connectivity

• Research unit: INNOSUISSE
• Project number: 14734.1;7 PFNM-NM

Short description (German)

HiPerCon: Superior thermal underfill with hierarchical percolating particle connectivity

Short description (English)

HiPerCon: Superior thermal underfill with hierarchical percolating particle connectivity

Abstract (German)

Thermal management is crucial to the success of 3D stacks of integrated circuits in next generation electronics components. Novel neck-based hierarchical thermal underfills (NHTU) are proposed to achieve efficient thermal transport, while avoiding electrical shorting. The approach exploits hierarchical percolating connectivity (HiPerCon) in filler particles. Materials and physicochemical innovations will be exploited to develop scalable synthesis and integration of NHTUs with thermal properties well beyond the state-of-the-art in the industry.

Abstract (English)

Thermal management is crucial to the success of 3D stacks of integrated circuits in next generation electronics components. Novel neck-based hierarchical thermal underfills (NHTU) are proposed to achieve efficient thermal transport, while avoiding electrical shorting. The approach exploits hierarchical percolating connectivity (HiPerCon) in filler particles. Materials and physicochemical innovations will be exploited to develop scalable synthesis and integration of NHTUs with thermal properties well beyond the state-of-the-art in the industry.