Developing the next generation of laser processing machines to process in more than 40% less time, complex PCD/CVD-D/CBN cutting tools by means of a novel dual processing head concept (Dual Laser Processing Head Concept)

• Unité de recherche: INNOSUISSE
• Numéro de projet: 14077.2 PFNM-NM
• Titre du projet anglais: Developing the next generation of laser processing machines to process in more than 40% less time, complex PCD/CVD-D/CBN cutting tools by means of a novel dual processing head concept (Dual Laser Processing Head Concept)

Description succincte (Allemand)

Developing the next generation of laser processing machines to process in more than 40% less time, complex PCD/CVD-D/CBN cutting tools by means of a novel dual processing head concept (Dual Laser Processing Head Concept)

Description succincte (Anglais)

Developing the next generation of laser processing machines to process in more than 40% less time, complex PCD/CVD-D/CBN cutting tools by means of a novel dual processing head concept (Dual Laser Processing Head Concept)

Résumé des résultats (Abstract) (Allemand)

Rapid processing of PCD/CVD-D/CBN cutting tools using two processing heads. Processing time will be reduced by more than 40% and a cutting edge radius and surface roughness (Ra) of < 2ìm and 0.2ìm can be achieved respectively.|To achieve this, accelerated material removal of the tool¿s contour is carried out by a cutting head using a nanosecond laser. Subsequently, ultrafine finishing of the tool¿s contour and chip breaker is carried out by a nanoscanner using a picosecond laser.|A new modular machine generation will be developed which adopts this duality concept.

Résumé des résultats (Abstract) (Anglais)

Rapid processing of PCD/CVD-D/CBN cutting tools using two processing heads. Processing time will be reduced by more than 40% and a cutting edge radius and surface roughness (Ra) of < 2ìm and 0.2ìm can be achieved respectively.|To achieve this, accelerated material removal of the tool¿s contour is carried out by a cutting head using a nanosecond laser. Subsequently, ultrafine finishing of the tool¿s contour and chip breaker is carried out by a nanoscanner using a picosecond laser.|A new modular machine generation will be developed which adopts this duality concept.