MINImizing the DIE Size Using LASER Dicing Processes (Mini Die).

• Unité de recherche: INNOSUISSE
• Numéro de projet: 13836.1;4 PFNM-NM
• Titre du projet anglais: MINImizing the DIE Size Using LASER Dicing Processes (Mini Die).

Description succincte (Anglais)

MINImizing the DIE Size Using LASER Dicing Processes (Mini Die).

Description succincte (Français)

MINImizing the DIE Size Using LASER Dicing Processes (Mini Die).

Résumé des résultats (Abstract) (Anglais)

With the trend of the miniaturisation of technology, the integrated devices become smaller and the dicing street becomes a non-negligible factor of the die size. The goal of the project is to evaluate the real capabilities of the laser dicing process and to know which kind of new constraints appear in the silicon and have to be taken into account for the process design to insure the quality and the reliability of EM's products.

Résumé des résultats (Abstract) (Français)

With the trend of the miniaturisation of technology, the integrated devices become smaller and the dicing street becomes a non-negligible factor of the die size. The goal of the project is to evaluate the real capabilities of the laser dicing process and to know which kind of new constraints appear in the silicon and have to be taken into account for the process design to insure the quality and the reliability of EM's products.