Miniaturization of on-skin electronics for use in Electrical Impedance Tomography

• Unité de recherche: INNOSUISSE
• Numéro de projet: 13384.1;10 PFFLE-LS
• Titre du projet anglais: Miniaturization of on-skin electronics for use in Electrical Impedance Tomography

Description succincte (Allemand)

Miniaturisierung der Messelektronik zur direkten Anwendung auf der Haut von Intensivpflegepatienten für Elektroimpedanz Tomographie

Description succincte (Anglais)

Miniaturization of on-skin electronics for use in Electrical Impedance Tomography

Résumé des résultats (Abstract) (Allemand)

Electrical Impedance Tomography (EIT) is an emerging technique to diagnose and monitor in real-time acute lung collapse in critically ill patients. The lives of thousands of patients and Millions of CHF can potentially be saved with this technology as it enables novel therapeutic possibilities. Swisstom has developed a unique solution (sensor belt) to measure EIT in the clinical setting. A key component of swisstom¿s technology is an electronic circuit which resides directly behind the skin electrodes (on-skin electronics). Currently, this electronic circuit is built with conventional SMD components on a printed circuit board. The goal of the project is to design an Application Specific Integrated Circuit (ASIC) to replace all SMD components, reduce cost, and finally improve reliability, usability and wearability

Résumé des résultats (Abstract) (Anglais)

Electrical Impedance Tomography (EIT) is an emerging technique to diagnose and monitor in real-time acute lung collapse in critically ill patients. The lives of thousands of patients and Millions of CHF can potentially be saved with this technology as it enables novel therapeutic possibilities. Swisstom has developed a unique solution (sensor belt) to measure EIT in the clinical setting. A key component of swisstom¿s technology is an electronic circuit which resides directly behind the skin electrodes (on-skin electronics). Currently, this electronic circuit is built with conventional SMD components on a printed circuit board. The goal of the project is to design an Application Specific Integrated Circuit (ASIC) to replace all SMD components, reduce cost, and finally improve reliability, usability and wearability