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Research unit
INNOSUISSE
Project number
13384.1;10 PFFLE-LS
Project title
Miniaturization of on-skin electronics for use in Electrical Impedance Tomography

Texts for this project

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Short description
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Abstract
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Inserted texts


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Short description
(German)
Miniaturisierung der Messelektronik zur direkten Anwendung auf der Haut von Intensivpflegepatienten für Elektroimpedanz Tomographie
Short description
(English)
Miniaturization of on-skin electronics for use in Electrical Impedance Tomography
Abstract
(German)
Electrical Impedance Tomography (EIT) is an emerging technique to diagnose and monitor in real-time acute lung collapse in critically ill patients. The lives of thousands of patients and Millions of CHF can potentially be saved with this technology as it enables novel therapeutic possibilities. Swisstom has developed a unique solution (sensor belt) to measure EIT in the clinical setting. A key component of swisstom¿s technology is an electronic circuit which resides directly behind the skin electrodes (on-skin electronics). Currently, this electronic circuit is built with conventional SMD components on a printed circuit board. The goal of the project is to design an Application Specific Integrated Circuit (ASIC) to replace all SMD components, reduce cost, and finally improve reliability, usability and wearability
Abstract
(English)
Electrical Impedance Tomography (EIT) is an emerging technique to diagnose and monitor in real-time acute lung collapse in critically ill patients. The lives of thousands of patients and Millions of CHF can potentially be saved with this technology as it enables novel therapeutic possibilities. Swisstom has developed a unique solution (sensor belt) to measure EIT in the clinical setting. A key component of swisstom¿s technology is an electronic circuit which resides directly behind the skin electrodes (on-skin electronics). Currently, this electronic circuit is built with conventional SMD components on a printed circuit board. The goal of the project is to design an Application Specific Integrated Circuit (ASIC) to replace all SMD components, reduce cost, and finally improve reliability, usability and wearability