SMARTFILL - Development of specific Underfiller process suitable for high operating temperature and miniaturized IO-Link SiP devices and MEMS systems.

• Unité de recherche: INNOSUISSE
• Numéro de projet: 13444.1;6 PFFLE-NM
• Titre du projet anglais: SMARTFILL - Development of specific Underfiller process suitable for high operating temperature and miniaturized IO-Link SiP devices and MEMS systems.

Description succincte (Allemand)

SMARTFILL - Development of specific Underfiller process suitable for high operating temperature and miniaturized IO-Link SiP devices and MEMS systems.

Description succincte (Anglais)

SMARTFILL - Development of specific Underfiller process suitable for high operating temperature and miniaturized IO-Link SiP devices and MEMS systems.

Résumé des résultats (Abstract) (Allemand)

The project aims to develop a 3D-process technology enabling Chip on Wafer manufacturing with StudBump/Thermosonic Bonding/Underfill technology to achieve high density System-in-Package (SiP) with increased operating temperature range. Onboard intelligence in miniaturized applications like sensors or MEMS combined with low cost and highly reliable packaging is the key differentiator to existing SiP solutions. To achieve low cost packaging, standard dicing and injection molding compatibility is mandatory, requiring a new Underfilling process.

Résumé des résultats (Abstract) (Anglais)

The project aims to develop a 3D-process technology enabling Chip on Wafer manufacturing with StudBump/Thermosonic Bonding/Underfill technology to achieve high density System-in-Package (SiP) with increased operating temperature range. Onboard intelligence in miniaturized applications like sensors or MEMS combined with low cost and highly reliable packaging is the key differentiator to existing SiP solutions. To achieve low cost packaging, standard dicing and injection molding compatibility is mandatory, requiring a new Underfilling process.