SMARTFILL - Development of specific Underfiller process suitable for high operating temperature and miniaturized IO-Link SiP devices and MEMS systems.

• Research unit: INNOSUISSE
• Project number: 13444.1;6 PFFLE-NM

Short description (German)

SMARTFILL - Development of specific Underfiller process suitable for high operating temperature and miniaturized IO-Link SiP devices and MEMS systems.

Short description (English)

SMARTFILL - Development of specific Underfiller process suitable for high operating temperature and miniaturized IO-Link SiP devices and MEMS systems.

Abstract (German)

The project aims to develop a 3D-process technology enabling Chip on Wafer manufacturing with StudBump/Thermosonic Bonding/Underfill technology to achieve high density System-in-Package (SiP) with increased operating temperature range. Onboard intelligence in miniaturized applications like sensors or MEMS combined with low cost and highly reliable packaging is the key differentiator to existing SiP solutions. To achieve low cost packaging, standard dicing and injection molding compatibility is mandatory, requiring a new Underfilling process.

Abstract (English)

The project aims to develop a 3D-process technology enabling Chip on Wafer manufacturing with StudBump/Thermosonic Bonding/Underfill technology to achieve high density System-in-Package (SiP) with increased operating temperature range. Onboard intelligence in miniaturized applications like sensors or MEMS combined with low cost and highly reliable packaging is the key differentiator to existing SiP solutions. To achieve low cost packaging, standard dicing and injection molding compatibility is mandatory, requiring a new Underfilling process.