Integrated Circuit Hall Sensor Array (ICHSA) Device for Eddy Current Non Destructive Testing: Validation Phase

• Forschungsstelle: INNOSUISSE
• Projektnummer: 12478.1;8 PFNM-NM
• Projekttitel Englisch: Integrated Circuit Hall Sensor Array (ICHSA) Device for Eddy Current Non Destructive Testing: Validation Phase

Kurzbeschreibung (Deutsch)

Integrated Circuit Hall Sensor Array (ICHSA) Device for Eddy Current Non Destructive Testing: Validation Phase

Kurzbeschreibung (Englisch)

Integrated Circuit Hall Sensor Array (ICHSA) Device for Eddy Current Non Destructive Testing: Validation Phase

Abstract (Deutsch)

Eddy current (EC) technique is one of the most attractive technologies in the field of industrial non destructive testing (NDT). The key challenge for a wider application of this technique is the innovation in the sensors used to detect and map the flaws. The present project aims at drastically improving this aspect by developing a novel EC product based on a CMOS micro Hall sensor chip allowing a local mapping of the magnetic field anomaly caused by the defect. The resulting probe will allow a drastic reduction of false positives and an improved accuracy in crack sizing. These features will ensure a clear market advantage for the resulting product. Considering the subsequent development of an expert system and the integration into dedicated systems, the probe will perform unprecedented robust and automated flaw reconstruction.

Abstract (Englisch)

Eddy current (EC) technique is one of the most attractive technologies in the field of industrial non destructive testing (NDT). The key challenge for a wider application of this technique is the innovation in the sensors used to detect and map the flaws. The present project aims at drastically improving this aspect by developing a novel EC product based on a CMOS micro Hall sensor chip allowing a local mapping of the magnetic field anomaly caused by the defect. The resulting probe will allow a drastic reduction of false positives and an improved accuracy in crack sizing. These features will ensure a clear market advantage for the resulting product. Considering the subsequent development of an expert system and the integration into dedicated systems, the probe will perform unprecedented robust and automated flaw reconstruction.