BOND: Innovative methodology for book press industry through specific RFID Transponder integrated with Book Binding Machines

• Forschungsstelle: INNOSUISSE
• Projektnummer: 11903.1;8 PFIW-IW
• Projekttitel Englisch: BOND: Innovative methodology for book press industry through specific RFID Transponder integrated with Book Binding Machines

Kurzbeschreibung (Deutsch)

BOND: Innovative methodology for book press industry through specific RFID Transponder integrated with Book Binding Machines

Kurzbeschreibung (Englisch)

BOND: Innovative methodology for book press industry through specific RFID Transponder integrated with Book Binding Machines

Abstract (Deutsch)

The BOND project will face the new frontier of the book press industry, targeting the production of small series of books satisfying the new needs of the market: small quantities request, reduced logistic and storage costs, reduced paper cost and waste. BOND will target specific RFID Tags, tailored to be integrated in a BOND book making line, at a reasonable speed of 800-1000 books/hour. The key elements that will be optimized are: the binding machine, the cover making system, the three side trimmer, the Gluing System Optimization and the RFID automatic insertion.

Abstract (Englisch)

The BOND project will face the new frontier of the book press industry, targeting the production of small series of books satisfying the new needs of the market: small quantities request, reduced logistic and storage costs, reduced paper cost and waste. BOND will target specific RFID Tags, tailored to be integrated in a BOND book making line, at a reasonable speed of 800-1000 books/hour. The key elements that will be optimized are: the binding machine, the cover making system, the three side trimmer, the Gluing System Optimization and the RFID automatic insertion.