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Unité de recherche
INNOSUISSE
Numéro de projet
10971.2;6 PFIW-IW
Titre du projet
Manufacturing process for micro-arrays of semi-periodic islands for innovative high security features
Titre du projet anglais
Manufacturing process for micro-arrays of semi-periodic islands for innovative high security features

Textes relatifs à ce projet

 AllemandFrançaisItalienAnglais
Description succincte
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Résumé des résultats (Abstract)
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Textes saisis


CatégorieTexte
Description succincte
(Allemand)
Manufacturing process for micro-arrays of semi-periodic islands for innovative high security features
Description succincte
(Anglais)
Manufacturing process for micro-arrays of semi-periodic islands for innovative high security features
Résumé des résultats (Abstract)
(Allemand)
The objective of the project is to develop a set of innovative security features consisting of an array of semi-periodic islands of well defined height with an average pitch in the range of 0.5 - 2 ìm. The actual volume product is replicated from a suitable master. The master is etched into silicon, silicon dioxide, or a polymer. The sidewall profile and texture of the features are carefully designed and are crucial factors determining the appearance and quality of the security features. Dry or plasma etching is a technique promising full control over both feature depth and profile. A new design concept and a novel processing route for the fabrication of the security features will be developed and tested in the course of the project.
Résumé des résultats (Abstract)
(Anglais)
The objective of the project is to develop a set of innovative security features consisting of an array of semi-periodic islands of well defined height with an average pitch in the range of 0.5 - 2 ìm. The actual volume product is replicated from a suitable master. The master is etched into silicon, silicon dioxide, or a polymer. The sidewall profile and texture of the features are carefully designed and are crucial factors determining the appearance and quality of the security features. Dry or plasma etching is a technique promising full control over both feature depth and profile. A new design concept and a novel processing route for the fabrication of the security features will be developed and tested in the course of the project.