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Forschungsstelle
INNOSUISSE
Projektnummer
10971.2;6 PFIW-IW
Projekttitel
Manufacturing process for micro-arrays of semi-periodic islands for innovative high security features
Projekttitel Englisch
Manufacturing process for micro-arrays of semi-periodic islands for innovative high security features

Texte zu diesem Projekt
 DeutschFranzösischItalienischEnglisch
Kurzbeschreibung
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Abstract
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Erfasste Texte


KategorieText
Kurzbeschreibung
(Deutsch)
Manufacturing process for micro-arrays of semi-periodic islands for innovative high security features
Kurzbeschreibung
(Englisch)
Manufacturing process for micro-arrays of semi-periodic islands for innovative high security features
Abstract
(Deutsch)
The objective of the project is to develop a set of innovative security features consisting of an array of semi-periodic islands of well defined height with an average pitch in the range of 0.5 - 2 ìm. The actual volume product is replicated from a suitable master. The master is etched into silicon, silicon dioxide, or a polymer. The sidewall profile and texture of the features are carefully designed and are crucial factors determining the appearance and quality of the security features. Dry or plasma etching is a technique promising full control over both feature depth and profile. A new design concept and a novel processing route for the fabrication of the security features will be developed and tested in the course of the project.
Abstract
(Englisch)
The objective of the project is to develop a set of innovative security features consisting of an array of semi-periodic islands of well defined height with an average pitch in the range of 0.5 - 2 ìm. The actual volume product is replicated from a suitable master. The master is etched into silicon, silicon dioxide, or a polymer. The sidewall profile and texture of the features are carefully designed and are crucial factors determining the appearance and quality of the security features. Dry or plasma etching is a technique promising full control over both feature depth and profile. A new design concept and a novel processing route for the fabrication of the security features will be developed and tested in the course of the project.