Ultrathin Layer Packaging of Intracranial Pressure Sensor

Fonte Standard Gras
Identifiant

Unité de recherche

INNOSUISSE

Numéro de projet

10836.1;9 PFLS-LS

Titre du projet

Ultrathin Layer Packaging of Intracranial Pressure Sensor

Titre du projet anglais

Ultrathin Layer Packaging of Intracranial Pressure Sensor

Textes relatifs à ce projet

	Allemand	Français	Italien	Anglais
Description succincte	-	-	-
Résumé des résultats (Abstract)	-	-	-

Textes saisis

Catégorie	Texte
Description succincte (Anglais)	Ultrathin Layer Packaging of Intracranial Pressure Sensor
Résumé des résultats (Abstract) (Anglais)	The objective of the project is the development of ultrathin multilayers for biocompatible hermetic packaging for next generation long-term implants (up to10 years). State of the art packaging using metal and glass housings are reliable but size- and cost-intensive. The proposed method of direct encapsulation of implantable devices by alternating of different coatings combines low permeability of the package with small dimensions and low-cost manufacturing. The first part of the project is developing the barrier layer systems equivalent to ¿packaging at wafer level (using MEMS technology)¿, in the second step these packages are directly applied to improve an established product (Codman intracranial pressure sensor).

Catégorie

Texte

Description succincte
(Anglais)

Ultrathin Layer Packaging of Intracranial Pressure Sensor

Résumé des résultats (Abstract)
(Anglais)

The objective of the project is the development of ultrathin multilayers for biocompatible hermetic packaging for next generation long-term implants (up to10 years). State of the art packaging using metal and glass housings are reliable but size- and cost-intensive. The proposed method of direct encapsulation of implantable devices by alternating of different coatings combines low permeability of the package with small dimensions and low-cost manufacturing. The first part of the project is developing the barrier layer systems equivalent to ¿packaging at wafer level (using MEMS technology)¿, in the second step these packages are directly applied to improve an established product (Codman intracranial pressure sensor).