Ultrathin Layer Packaging of Intracranial Pressure Sensor

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Research unit

INNOSUISSE

Project number

10836.1;9 PFLS-LS

Project title

Ultrathin Layer Packaging of Intracranial Pressure Sensor

Texts for this project

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Short description	-	-	-
Abstract	-	-	-

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Category	Text
Short description (English)	Ultrathin Layer Packaging of Intracranial Pressure Sensor
Abstract (English)	The objective of the project is the development of ultrathin multilayers for biocompatible hermetic packaging for next generation long-term implants (up to10 years). State of the art packaging using metal and glass housings are reliable but size- and cost-intensive. The proposed method of direct encapsulation of implantable devices by alternating of different coatings combines low permeability of the package with small dimensions and low-cost manufacturing. The first part of the project is developing the barrier layer systems equivalent to ¿packaging at wafer level (using MEMS technology)¿, in the second step these packages are directly applied to improve an established product (Codman intracranial pressure sensor).

Category

Text

Short description
(English)

Ultrathin Layer Packaging of Intracranial Pressure Sensor

Abstract
(English)

The objective of the project is the development of ultrathin multilayers for biocompatible hermetic packaging for next generation long-term implants (up to10 years). State of the art packaging using metal and glass housings are reliable but size- and cost-intensive. The proposed method of direct encapsulation of implantable devices by alternating of different coatings combines low permeability of the package with small dimensions and low-cost manufacturing. The first part of the project is developing the barrier layer systems equivalent to ¿packaging at wafer level (using MEMS technology)¿, in the second step these packages are directly applied to improve an established product (Codman intracranial pressure sensor).