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Unité de recherche
INNOSUISSE
Numéro de projet
10705.2;7 PFNM-NM
Titre du projet
The project Bubble Detection (hereafter named BUD) aims at developing a sensor detecting bubbles to be integrated into an existing flowmeter for semiconductor applications
Titre du projet anglais
The project Bubble Detection (hereafter named BUD) aims at developing a sensor detecting bubbles to be integrated into an existing flowmeter for semiconductor applications

Textes relatifs à ce projet

 AllemandFrançaisItalienAnglais
Description succincte
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Résumé des résultats (Abstract)
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Textes saisis


CatégorieTexte
Description succincte
(Allemand)
The project Bubble Detection (hereafter named BUD) aims at developing a sensor detecting bubbles to be integrated into an existing flowmeter for semiconductor applications
Description succincte
(Anglais)
The project Bubble Detection (hereafter named BUD) aims at developing a sensor detecting bubbles to be integrated into an existing flowmeter for semiconductor applications
Résumé des résultats (Abstract)
(Allemand)
The aim of this project is two-fold: to develop a fast response bubble detector which both detects the presence of microbubbles and evaluates their size, and to integrate this bubble detector into a non-invasive, non-intrusive, contact-less laser-based flowmeter for dispensing extremely high purity, microbubble-free liquids for high-resolution (sub- 100 nm) wafer fabrication. The combined instrument will enable effective elimination of bubble-induced defects in the thin photoresist layers spun on silicon wafers.
Résumé des résultats (Abstract)
(Anglais)
The aim of this project is two-fold: to develop a fast response bubble detector which both detects the presence of microbubbles and evaluates their size, and to integrate this bubble detector into a non-invasive, non-intrusive, contact-less laser-based flowmeter for dispensing extremely high purity, microbubble-free liquids for high-resolution (sub- 100 nm) wafer fabrication. The combined instrument will enable effective elimination of bubble-induced defects in the thin photoresist layers spun on silicon wafers.