Feasibility study on hermetic implantable interface chips for neurostimulation (NeuroPack)

Research unit

INNOSUISSE

Project number

10763.1;3 PFLS-LS

Project title

Feasibility study on hermetic implantable interface chips for neurostimulation (NeuroPack)

Texts for this project

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Short description	-	-	-
Abstract	-	-	-

Category	Text
Short description (English)	Feasibility study on hermetic implantable interface chips for neurostimulation (NeuroPack)
Abstract (English)	Modern active medical implants are constrained in application by technology. Lifting this constraint requires radically new platform technologies for tissue interface, device packaging, and system architectures. In this feasibility study, the possibility for hermetically sealed implantable chips based on the use of biocompatible materials is evaluated.