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Unité de recherche
INNOSUISSE
Numéro de projet
9908.2;4 PFNM-NM
Titre du projet
Ultra-high conductivity metallization pastes for heterojunction solar cells (TCOC)
Titre du projet anglais
Ultra-high conductivity metallization pastes for heterojunction solar cells (TCOC)

Textes relatifs à ce projet

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Résumé des résultats (Abstract)
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Textes saisis


CatégorieTexte
Description succincte
(Anglais)
Ultra-high conductivity metallization pastes for heterojunction solar cells (TCOC)
Description succincte
(Français)
Ultra-high conductivity metallization pastes for heterojunction solar cells (TCOC)
Résumé des résultats (Abstract)
(Anglais)
The TCOC project aims at developing nano-enabled low temperature curable silver pastes exhibiting resistivity below 1¿ª10-5 ¿Ç¿ªcm compatible with high efficiency heterojunction solar cells (HJC). To attain the desired conductivity level, the silver pastes will contain a mix of micron-size silver particles and low cost silver nanoparticles as a conductivity enhancer active at low temperatures. As nanoparticles are expected to have a detrimental effect on rheology, paste development will also focus on obtaining high aspect ratio screen printable pastes. Seed layer pastes for further plating will finally be trialed as they may offer an interesting alternative for high performance metallization of HJC.
Résumé des résultats (Abstract)
(Français)
The TCOC project aims at developing nano-enabled low temperature curable silver pastes exhibiting resistivity below 1¿ª10-5 ¿Ç¿ªcm compatible with high efficiency heterojunction solar cells (HJC). To attain the desired conductivity level, the silver pastes will contain a mix of micron-size silver particles and low cost silver nanoparticles as a conductivity enhancer active at low temperatures. As nanoparticles are expected to have a detrimental effect on rheology, paste development will also focus on obtaining high aspect ratio screen printable pastes. Seed layer pastes for further plating will finally be trialed as they may offer an interesting alternative for high performance metallization of HJC.