JUPITER - Development of a high-performance RF receiver IC for GNSS in standard digital CMOS

Fonte Standard Gras
Identifiant

Unité de recherche

INNOSUISSE

Numéro de projet

9782.1;6 PFNM-NM

Titre du projet

JUPITER - Development of a high-performance RF receiver IC for GNSS in standard digital CMOS

Titre du projet anglais

JUPITER - Development of a high-performance RF receiver IC for GNSS in standard digital CMOS

Textes relatifs à ce projet

	Allemand	Français	Italien	Anglais
Description succincte	-	-	-
Résumé des résultats (Abstract)	-	-	-

Textes saisis

Catégorie	Texte
Description succincte (Anglais)	JUPITER - Development of a high-performance RF receiver IC for GNSS in standard digital CMOS
Résumé des résultats (Abstract) (Anglais)	Development of a high-performance RF receiver IC for GNSS in standard digital CMOS. The goal of the project is to develop a best-in-class RF IC for GNSS, in a deep-submicron CMOS technology. This RF IC will be a crucial part for the next generation GNSS platform. The outcomes of the project are the following: Development of an innovative low-voltage low-power RF IP enabling ultimately the realization of a real single chip solution when combining both the RF and baseband circuitry on a single die. RF IP technology transfer from CSEM to the industrial partner in order to enable the partner to build its own RF IC design group and to generate its own proprietary RF IP.

Catégorie

Texte

Description succincte
(Anglais)

JUPITER - Development of a high-performance RF receiver IC for GNSS in standard digital CMOS

Résumé des résultats (Abstract)
(Anglais)

Development of a high-performance RF receiver IC for GNSS in standard digital CMOS. The goal of the project is to develop a best-in-class RF IC for GNSS, in a deep-submicron CMOS technology. This RF IC will be a crucial part for the next generation GNSS platform. The outcomes of the project are the following: Development of an innovative low-voltage low-power RF IP enabling ultimately the realization of a real single chip solution when combining both the RF and baseband circuitry on a single die. RF IP technology transfer from CSEM to the industrial partner in order to enable the partner to build its own RF IC design group and to generate its own proprietary RF IP.