Micro-Evaporation Cooling System for High Performance Micro-Processors: Development of Prototype Units and Performance Testing

• Forschungsstelle: INNOSUISSE
• Projektnummer: 9229.1;7 PFNM-NM
• Projekttitel Englisch: Micro-Evaporation Cooling System for High Performance Micro-Processors: Development of Prototype Units and Performance Testing

Kurzbeschreibung (Deutsch)

Micro-Evaporation Cooling System for High Performance Micro-Processors: Development of Prototype Units and Performance Testing

Kurzbeschreibung (Englisch)

Micro-Evaporation Cooling System for High Performance Micro-Processors: Development of Prototype Units and Performance Testing

Abstract (Deutsch)

The goal of this project is to develop the first operational micro-evaporation cooling system for an array of highperformance micro-processors. Specific objectives are to: i) optimize the geometry of the microchannelcooling element and improve modeling for critical heat flux, pressure drop, and flow boiling heat transfer, ii)design/fabricate a complete prototype cooling system using our microchannel evaporation technology todissipate 350 W/cm2 from the footprint of one processor and from an array of four processors, iii) obtaincomplete system performance data under variable load conditions including reliability and lifetime data, iv)develop technology for integration of the new cooling system into server and mainframe working environmentswith OEM's.

Abstract (Englisch)

The goal of this project is to develop the first operational micro-evaporation cooling system for an array of highperformance micro-processors. Specific objectives are to: i) optimize the geometry of the microchannelcooling element and improve modeling for critical heat flux, pressure drop, and flow boiling heat transfer, ii)design/fabricate a complete prototype cooling system using our microchannel evaporation technology todissipate 350 W/cm2 from the footprint of one processor and from an array of four processors, iii) obtaincomplete system performance data under variable load conditions including reliability and lifetime data, iv)develop technology for integration of the new cooling system into server and mainframe working environmentswith OEM's.