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Unité de recherche
INNOSUISSE
Numéro de projet
8829.2;7 PFIW-IW
Titre du projet
Feasability Study CTI / Alliance: Silicon recycling from wafering waste to produce reusable photovoltaic feedstock
Titre du projet anglais
Silicon recycling from wafering waste to produce reusable photovoltaic feedstock

Textes relatifs à ce projet

 AllemandFrançaisItalienAnglais
Description succincte
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Résumé des résultats (Abstract)
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Textes saisis


CatégorieTexte
Description succincte
(Anglais)
Silicon recycling from wafering waste to produce reusable photovoltaic feedstock
Description succincte
(Français)
Feasability Study CTI / Alliance: Silicon recycling from wafering waste to produce reusable photovoltaic feedstock
Résumé des résultats (Abstract)
(Anglais)
The objective of the SIRE project is the demonstration of a process that allows the recycling of 80% of the silicon saw residues contained in exhausted wire-saw cutting slurries from the production of silicon wafers for the photovoltaic (PV) industry. During the slicing of silicon blocks into thin wafers (150-200 micron thick) by multi-wire slurry sawing (MWSS) technology, around 50% of the silicon (or about 3 tons of silicon per MW produced PV power at 15% module efficiency), that entered the wafering process, is lost in form of fine, micron sized silicon powders which accumulate in the wire sawing slurries.
Résumé des résultats (Abstract)
(Français)
The objective of the SIRE project is the demonstration of a process that allows the recycling of 80% of the silicon saw residues contained in exhausted wire-saw cutting slurries from the production of silicon wafers for the photovoltaic (PV) industry. During the slicing of silicon blocks into thin wafers (150-200 micron thick) by multi-wire slurry sawing (MWSS) technology, around 50% of the silicon (or about 3 tons of silicon per MW produced PV power at 15% module efficiency), that entered the wafering process, is lost in form of fine, micron sized silicon powders which accumulate in the wire sawing slurries.