Micro-Refrigeration System for Cooling of Computer Chips - CTI Discovery Project

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Projektnummer

6862.2;12 DCPP-NM

Projekttitel

Micro-Refrigeration System for Cooling of Computer Chips - CTI Discovery Project

Projekttitel Englisch

Micro-Evaporation Systems for Cooling of Computer Chips - CTI Discovery Project

Texte zu diesem Projekt

	Deutsch	Französisch	Italienisch	Englisch
Kurzbeschreibung	-	-	-
Abstract	-	-	-

Erfasste Texte

Kategorie	Text
Kurzbeschreibung (Englisch)	Micro-Refrigeration System for Cooling of Computer Chips - CTI Discovery Project
Abstract (Englisch)	The main objectives of this Discovery Project are: i) proof-of-concept for a micro-evaporation system to dissipate 250 W/cm2 (increase from 150 W/cm2 in pre-proposal) from the footprint of a computer CPU chip, ii) analyze competitive solutions used for cooling of computer chips (single phase, impinging jets, heat pipes and spray cooling), iii) identify the most efficient and reliable pump type for the micro-evaporation system, iv) measure critical heat fluxes (CHF) for flow boiling in different geometries of micro-channels to be used in the CPU cooling element, v) applying/developing new thermal design methods for modeling of boiling heat transfer and fluid flow in these micro-cooling elements, vi) identify another company to fabricate micro-channel heat exchangers or miniaturized condensers and micro-pumps.

Kategorie

Text

Kurzbeschreibung
(Englisch)

Micro-Refrigeration System for Cooling of Computer Chips - CTI Discovery Project

Abstract
(Englisch)

The main objectives of this Discovery Project are: i) proof-of-concept for a micro-evaporation system to dissipate 250 W/cm2 (increase from 150 W/cm2 in pre-proposal) from the footprint of a computer CPU chip, ii) analyze competitive solutions used for cooling of computer chips (single phase, impinging jets, heat pipes and spray cooling), iii) identify the most efficient and reliable pump type for the micro-evaporation system, iv) measure critical heat fluxes (CHF) for flow boiling in different geometries of micro-channels to be used in the CPU cooling element, v) applying/developing new thermal design methods for modeling of boiling heat transfer and fluid flow in these micro-cooling elements, vi) identify another company to fabricate micro-channel heat exchangers or miniaturized condensers and micro-pumps.