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Forschungsstelle
INNOSUISSE
Projektnummer
8039.2;7 NMPP-NM
Projekttitel
Dosens II: Development of a new dissolved oxygen sensor for activated sludge monitoring based on a membrane-less, self-calibrating, self-cleaning microdisk array sensing electrode
Projekttitel Englisch
Development of a new dissolved oxygen sensor for activated sludge monitoring based on a membrane-less, self-calibrating, self-cleaning microdisk array sensing electrode

Texte zu diesem Projekt

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Kurzbeschreibung
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Erfasste Texte


KategorieText
Kurzbeschreibung
(Deutsch)
Dosens II: Development of a new dissolved oxygen sensor for activated sludge monitoring based on a membrane-less, self-calibrating, self-cleaning microdisk array sensing electrode
Kurzbeschreibung
(Englisch)
Development of a new dissolved oxygen sensor for activated sludge monitoring based on a membrane-less, self-calibrating, self-cleaning microdisk array sensing electrode
Abstract
(Deutsch)
A new microfabricated oxygen sensor allowing innovating 'in-situ' self-calibration and self-cleaning functions was developed within the KTI 'DoSens' project. The sensor and its dedicated control electronics was field-tested in activated sludge. Positive and encouraging results were obtained but a sensor chip construction weakness was identified. In this follow up project, modifications of the sensor chip architecture will be implemented and tested in order to obtain the required sensor life-time and guarantee the commercial manufacturability of the chip.
Abstract
(Englisch)
A new microfabricated oxygen sensor allowing innovating 'in-situ' self-calibration and self-cleaning functions was developed within the KTI 'DoSens' project. The sensor and its dedicated control electronics was field-tested in activated sludge. Positive and encouraging results were obtained but a sensor chip construction weakness was identified. In this follow up project, modifications of the sensor chip architecture will be implemented and tested in order to obtain the required sensor life-time and guarantee the commercial manufacturability of the chip.