Temperaqture-Aware Driver Design and Integration (TADDI)

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Identifiant

Unité de recherche

INNOSUISSE

Numéro de projet

7458.2;3 NMPP-NM

Titre du projet

Temperature-Aware Driver Design and Integration (TADDI)

Titre du projet anglais

Temperature-Aware Driver Design and Integration (TADDI)

Textes relatifs à ce projet

	Allemand	Français	Italien	Anglais
Description succincte	-	-	-
Résumé des résultats (Abstract)	-	-	-

Textes saisis

Catégorie	Texte
Description succincte (Anglais)	Temperaqture-Aware Driver Design and Integration (TADDI)
Résumé des résultats (Abstract) (Anglais)	Thermal issues in the design of driver IC¿s for VCSEL¿s and in their integration into complete optoelectronic transmitter packages are becoming critical due to higher operation speed (up to 10 Gb/s per channel), more compact packages and harsh environment application areas. In this project, a methodology for temperature-aware chip-level and package-level design is developed. Using this approach, design guidelines for integration of driver IC¿s into packages are derived and a new driver IC for flip-chip assembly onto a silicon bench is designed.

Catégorie

Texte

Description succincte
(Anglais)

Temperaqture-Aware Driver Design and Integration (TADDI)

Résumé des résultats (Abstract)
(Anglais)

Thermal issues in the design of driver IC¿s for VCSEL¿s and in their integration into complete optoelectronic transmitter packages are becoming critical due to higher operation speed (up to 10 Gb/s per channel), more compact packages and harsh environment application areas. In this project, a methodology for temperature-aware chip-level and package-level design is developed. Using this approach, design guidelines for integration of driver IC¿s into packages are derived and a new driver IC for flip-chip assembly onto a silicon bench is designed.