Temperature-Aware Driver Design and Integration (TADDI)

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Research unit

INNOSUISSE

Project number

7458.2;3 NMPP-NM

Project title

Temperature-Aware Driver Design and Integration (TADDI)

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Short description (English)	Temperaqture-Aware Driver Design and Integration (TADDI)
Abstract (English)	Thermal issues in the design of driver IC¿s for VCSEL¿s and in their integration into complete optoelectronic transmitter packages are becoming critical due to higher operation speed (up to 10 Gb/s per channel), more compact packages and harsh environment application areas. In this project, a methodology for temperature-aware chip-level and package-level design is developed. Using this approach, design guidelines for integration of driver IC¿s into packages are derived and a new driver IC for flip-chip assembly onto a silicon bench is designed.

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Text

Short description
(English)

Temperaqture-Aware Driver Design and Integration (TADDI)

Abstract
(English)

Thermal issues in the design of driver IC¿s for VCSEL¿s and in their integration into complete optoelectronic transmitter packages are becoming critical due to higher operation speed (up to 10 Gb/s per channel), more compact packages and harsh environment application areas. In this project, a methodology for temperature-aware chip-level and package-level design is developed. Using this approach, design guidelines for integration of driver IC¿s into packages are derived and a new driver IC for flip-chip assembly onto a silicon bench is designed.