Temperaqture-Aware Driver Design and Integration (TADDI)

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Projektnummer

7458.2;3 NMPP-NM

Projekttitel

Temperaqture-Aware Driver Design and Integration (TADDI)

Projekttitel Englisch

Temperature-Aware Driver Design and Integration (TADDI)

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	Deutsch	Französisch	Italienisch	Englisch
Kurzbeschreibung	-	-	-
Abstract	-	-	-

Erfasste Texte

Kategorie	Text
Kurzbeschreibung (Englisch)	Temperaqture-Aware Driver Design and Integration (TADDI)
Abstract (Englisch)	Thermal issues in the design of driver IC¿s for VCSEL¿s and in their integration into complete optoelectronic transmitter packages are becoming critical due to higher operation speed (up to 10 Gb/s per channel), more compact packages and harsh environment application areas. In this project, a methodology for temperature-aware chip-level and package-level design is developed. Using this approach, design guidelines for integration of driver IC¿s into packages are derived and a new driver IC for flip-chip assembly onto a silicon bench is designed.

Kategorie

Text

Kurzbeschreibung
(Englisch)

Temperaqture-Aware Driver Design and Integration (TADDI)

Abstract
(Englisch)

Thermal issues in the design of driver IC¿s for VCSEL¿s and in their integration into complete optoelectronic transmitter packages are becoming critical due to higher operation speed (up to 10 Gb/s per channel), more compact packages and harsh environment application areas. In this project, a methodology for temperature-aware chip-level and package-level design is developed. Using this approach, design guidelines for integration of driver IC¿s into packages are derived and a new driver IC for flip-chip assembly onto a silicon bench is designed.