HIGH-RESOLUTION HIGH-BANDWIDTH DIGITIZER MULTI-CHIP MODULE WITH TIME-INTERLEAVED PARALLEL CHANNELS AND BUILT-IN CALIBRATION

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Projektnummer

7609.2;2 NMPP-NM

Projekttitel

HIGH-RESOLUTION HIGH-BANDWIDTH DIGITIZER MULTI-CHIP MODULE WITH TIME-INTERLEAVED PARALLEL CHANNELS AND BUILT-IN CALIBRATION

Projekttitel Englisch

HIGH-RESOLUTION HIGH-BANDWIDTH DIGITIZER MULTI-CHIP MODULE WITH TIME-INTERLEAVED PARALLEL CHANNELS AND BUILT-IN CALIBRATION

Texte zu diesem Projekt

	Deutsch	Französisch	Italienisch	Englisch
Kurzbeschreibung	-	-	-
Abstract	-	-	-

Erfasste Texte

Kategorie	Text
Kurzbeschreibung (Englisch)	HIGH-RESOLUTION HIGH-BANDWIDTH DIGITIZER MULTI-CHIP MODULE WITH TIME-INTERLEAVED PARALLEL CHANNELS AND BUILT-IN CALIBRATION
Abstract (Englisch)	The goal of this project is to demonstrate the prototype of a multi-chip module digitizer for very high-speed data acquisition applications. The target features are 12-bit resolution and 5GHz input bandwidth, using two new state-of-the-art integrated circuits, a multi-channel Track-and-Hold front-end and a time-interleaved Analog-to-Digital Converter chips with built-in calibration. The prototype design will form the basis of digitizers for critical wireless communication and radar applications.

Kategorie

Text

Kurzbeschreibung
(Englisch)

HIGH-RESOLUTION HIGH-BANDWIDTH DIGITIZER MULTI-CHIP MODULE WITH TIME-INTERLEAVED PARALLEL CHANNELS AND BUILT-IN CALIBRATION

Abstract
(Englisch)

The goal of this project is to demonstrate the prototype of a multi-chip module digitizer for very high-speed data acquisition applications. The target features are 12-bit resolution and 5GHz input bandwidth, using two new state-of-the-art integrated circuits, a multi-channel Track-and-Hold front-end and a time-interleaved Analog-to-Digital Converter chips with built-in calibration. The prototype design will form the basis of digitizers for critical wireless communication and radar applications.