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Unité de recherche
INNOSUISSE
Numéro de projet
8427.2;6 NMPP-NM
Titre du projet
COMMED - Wireless Communication System for Medical Applications
Titre du projet anglais
COMMED - Wireless Communication System for Medical Applications

Textes relatifs à ce projet

 AllemandFrançaisItalienAnglais
Description succincte
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Résumé des résultats (Abstract)
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Textes saisis


CatégorieTexte
Description succincte
(Anglais)
COMMED - Wireless Communication System for Medical Applications
Description succincte
(Français)
COMMED - Wireless Communication System for Medical Applications
Résumé des résultats (Abstract)
(Anglais)
There is an increasing demand in the medical market for ultra low power, low cost, small size, radio frequency communication devices that can support low to medium data rates, multiple user capabilities, and operation with a very long battery life and in severe multipath environment. Examples can be found in body area networking and applications such as hearing aids for the transmission of vital parameters or compressed audio. To answer this increasing demand, the objective of this CTI project is to develop a novel ultra low power radio CMOS chip using a new and very promising wireless technology that can be interfaced with AMIS¿s existing (and future) digital signal processing (DSP) and medical technologies (e.g., DSP system-on-a-chip (SoC) or implantable SoC).
Résumé des résultats (Abstract)
(Français)
There is an increasing demand in the medical market for ultra low power, low cost, small size, radio frequency communication devices that can support low to medium data rates, multiple user capabilities, and operation with a very long battery life and in severe multipath environment. Examples can be found in body area networking and applications such as hearing aids for the transmission of vital parameters or compressed audio. To answer this increasing demand, the objective of this CTI project is to develop a novel ultra low power radio CMOS chip using a new and very promising wireless technology that can be interfaced with AMIS¿s existing (and future) digital signal processing (DSP) and medical technologies (e.g., DSP system-on-a-chip (SoC) or implantable SoC).