ServicenavigationHauptnavigationTrailKarteikarten


Research unit
INNOSUISSE
Project number
8427.2;6 NMPP-NM
Project title
COMMED - Wireless Communication System for Medical Applications

Texts for this project

 GermanFrenchItalianEnglish
Short description
-
Anzeigen
-
Anzeigen
Abstract
-
Anzeigen
-
Anzeigen

Inserted texts


CategoryText
Short description
(English)
COMMED - Wireless Communication System for Medical Applications
Short description
(French)
COMMED - Wireless Communication System for Medical Applications
Abstract
(English)
There is an increasing demand in the medical market for ultra low power, low cost, small size, radio frequency communication devices that can support low to medium data rates, multiple user capabilities, and operation with a very long battery life and in severe multipath environment. Examples can be found in body area networking and applications such as hearing aids for the transmission of vital parameters or compressed audio. To answer this increasing demand, the objective of this CTI project is to develop a novel ultra low power radio CMOS chip using a new and very promising wireless technology that can be interfaced with AMIS¿s existing (and future) digital signal processing (DSP) and medical technologies (e.g., DSP system-on-a-chip (SoC) or implantable SoC).
Abstract
(French)
There is an increasing demand in the medical market for ultra low power, low cost, small size, radio frequency communication devices that can support low to medium data rates, multiple user capabilities, and operation with a very long battery life and in severe multipath environment. Examples can be found in body area networking and applications such as hearing aids for the transmission of vital parameters or compressed audio. To answer this increasing demand, the objective of this CTI project is to develop a novel ultra low power radio CMOS chip using a new and very promising wireless technology that can be interfaced with AMIS¿s existing (and future) digital signal processing (DSP) and medical technologies (e.g., DSP system-on-a-chip (SoC) or implantable SoC).