UFER ¿ Ultra Fast Epoxy Removal This project proposal is part of a transnational MNT-ERA.Net proposal. The full proposal to the MNT-ERA.Net institution and the proposal to the German funding institution PTKA-PFT are submitted in parallel.

• Research unit: INNOSUISSE
• Project number: 8386.1;5 NMPP-NM

Short description (German)

UFER - Ultra Fast Epoxy Removal MNT-ERA Net proposal: The full proposal to the MNT-ERA Net institution and the proposal to Grman institution PTKA-PFT are submitted in parallel

Short description (English)

UFER ¿ Ultra Fast Epoxy Removal This project proposal is part of a transnational MNT-ERA.Net proposal. The full proposal to the MNT-ERA.Net institution and the proposal to the German funding institution PTKA-PFT are submitted in parallel.

Abstract (German)

This KTI/CTI project covers the process development, the microcomponents fabrication and the characterization aspects of an international project aimed at the development of a novel remote-plasma based SU-8 removal process including the design and construction of dedicated equipment. For the first time, the new technique will allow high-throughput residue-free removal of cross-linked SU-8 photoresist from high aspect ratio structures using dry processing. The availability of such a process and corresponding equipment will allow microcomponents manufacturers to make full use of the exceptional capabilities of the LIGA process by enabling them to remove the SU-8 mold at the end of the process flow in a production-worthy environment. Such process & equipment has been lacking for a long time. With the help of the anticipated results of the project, it is expected that a major roadblock preventing the more widespread use of SU-8 based LIGA in the high-volume production of microstructures will be eliminated.

Abstract (English)

This KTI/CTI project covers the process development, the microcomponents fabrication and the characterization aspects of an international project aimed at the development of a novel remote-plasma based SU-8 removal process including the design and construction of dedicated equipment. For the first time, the new technique will allow high-throughput residue-free removal of cross-linked SU-8 photoresist from high aspect ratio structures using dry processing. The availability of such a process and corresponding equipment will allow microcomponents manufacturers to make full use of the exceptional capabilities of the LIGA process by enabling them to remove the SU-8 mold at the end of the process flow in a production-worthy environment. Such process & equipment has been lacking for a long time. With the help of the anticipated results of the project, it is expected that a major roadblock preventing the more widespread use of SU-8 based LIGA in the high-volume production of microstructures will be eliminated.