Abstract
(Englisch)
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The objective of the LIPS project is to develop an interconnect/packaging and sub-system integration technology for low-cost millimetre-wave communication and radar applications including consumer products. The objective will be achieved by using existing high-density interconnect (HDI) and bare die attachment technologies and by adapting them to operate in the millimetre-wave range.
The following technologies will be assessed:
- Substrates: advanced MCM-L, MCM-D, and combined MCM-L/D interconnect;
- Bare die attachment: flip-chip assembly and embedded chip interconnect;
- Subsystem integration: integrated capacitors, resistors and inductors, antennas, couplers and filters, providing an MCM/BGA package.
Two demonstrators to validate the developed technologies for volume production:
- a 60 GHz Tx/Rx module for the next generation WLAN;
- the front-end of a 77 GHz automotive collision avoidance radar.
Work description:
The project workplan contains three phases of work.
The first phase aims for a preliminary specification of each technology demonstrator in order to define details of needed components, performance size and cost. It also includes specification and justification of selected materials and processes to be used for the realization of demonstrators.
In the second phase the work focuses on technology enhancement, characterization of integrated components, and simulation work using dedicated test vehicles. The procedure of test vehicle design, simulations, characterization and technology enhancement is to be repeated twice. The phase ends with the first technology assessment with respect to cost, performance, reliability and industrial usability. Meanwhile, technology demonstrator activities run in parallel. Die procurement starts early to ensure the availability of components needed. Then, detailed specification of demonstrators and finally the design work follow, incorporating the results of the technology characterization and enhancement.
The third phase consists of manufacturing and evaluation of demonstrators, followed by the final technology capability evaluation, comprising again cost, performance, reliability, and volume capability.
All along the project duration, the following objectives will be addressed:
- Cost improvements with respect to traditional technologies
- market analysis and end-user needs
- potential exploitation of technologies and tools.
The project is divided in 6 workpackages (in brackets WP leaders):
WP1: Management and exploitation (ACREO, SWEDEN);
WP2: Design and measurement of test vehicles (ETH, SWITZERLAND);
WP3: MCM-L and M-HDI technologies enhancement (CIMULEC, FRANCE);
WP4: MCM-D technology enhancement (TCM, FRANCE);
WP5 : 60 GHz Tx/Rx module demonstrator (TH-LCR, FRANCE)
WP6 : 77 GHz radar demonstrator (KITRON, SWEDEN).
Milestones:
- Adaptation of HDI technology to mm-wave applications
- Delivery of a process-specific mm-wave component library
- Demonstrators fabricated, validated, and benchmarked.
Overall outcome of the LIPS project is a matrix comparing performance, cost effectiveness, and volume capability of the LIPS technologies among themselves and to existing millimetre-wave packaging and interconnect solutions
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