Thermo-mechanical model for a chip-on-foil assembly (COFSIM)

• Unité de recherche: INNOSUISSE
• Numéro de projet: 6856.1;4 FHS-NM
• Titre du projet anglais: Thermo-mechanical model for a chip-on-foil assembly (COFSIM)

Description succincte (Allemand)

Thermo-mechanical model for a chip-on-foil assembly (COFSIM)

Description succincte (Anglais)

Thermo-mechanical model for a chip-on-foil assembly (COFSIM)

Résumé des résultats (Abstract) (Anglais)

In this project, a thermo-mechanical model for a display driver-IC chip-on-foil (COF) assembly process is developed based on the NM SESES finite (FE) software. Such a model is essential to optimize the COF bonding process and to improve the reliability of these components. The model will be also able to calculate the time dependent temperature distribution during the bonding process and to compute deformation and stresses in the structures.