Thermo-mechanical model for a chip-on-foil assembly (COFSIM) - Texts

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Research unit

INNOSUISSE

Project number

6856.1;4 FHS-NM

Project title

Thermo-mechanical model for a chip-on-foil assembly (COFSIM)

Texts for this project

	German	French	Italian	English
Short description		-	-
Abstract	-	-	-

Inserted texts

Category	Text
Short description (German)	Thermo-mechanical model for a chip-on-foil assembly (COFSIM)
Short description (English)	Thermo-mechanical model for a chip-on-foil assembly (COFSIM)
Abstract (English)	In this project, a thermo-mechanical model for a display driver-IC chip-on-foil (COF) assembly process is developed based on the NM SESES finite (FE) software. Such a model is essential to optimize the COF bonding process and to improve the reliability of these components. The model will be also able to calculate the time dependent temperature distribution during the bonding process and to compute deformation and stresses in the structures.