NANOJOINING: Novel nano composite polymers and joining technologies for reliable and efficient assembly of electronic components

• Research unit: EU RFP
• Project number: 01.0575

Key words (English)

Electrically conductive adhesives; nanotechnology; nano-sised silver particles; silver filled adhesives; flip-chip; underfill; ink-jet dispensing; high resolution conductive adhesives; thermally conductive adhesives;
Economic Aspects; Environmental

Alternative project number (English)

EU project number: G1RD-CT-2002-00656

Research programs (English)

EU-programme: 5. Frame Research Programme - 1.3.1 Innovative products, processes and organization

Short description (English)

See abstract

Partners and International Organizations (English)

Coordinator: Institute of Industrial Technology (NL)

Abstract (English)

The aim of this project is to develop new materials and processing techniques for bonding and under filling of flip chips and bonding of heat sinks in order to realise a step improvement in flip chip technology and to allow a further minituarisation (in the design) of microelectronic products. The goals are: a reduction of 40% in size, weight, material consumption and power consumption of various products like mobile telecommunication equipment, computers, monitors, controller units for automotive applications, etc. Targeted developments are:
1) new under fill materials containing nano-size fillers with superior properties;
2)new electrically and/or thermally conductive adhesives;
3) a transfer moulding process capable of under filling flip chips in mass volumes (e.g. 200 in one pass) at low costs;
4) an inkjet dispensing technique for electrically and thermally conductive adhesives.

References in databases (English)

Swiss Database: Euro-DB of the
State Secretariat for Education and Research
Hallwylstrasse 4
CH-3003 Berne, Switzerland
Tel. [phone]
Swiss Project-Number: 01.0575