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Forschungsstelle
EU FRP
Projektnummer
01.0575
Projekttitel
NANOJOINING: Novel nano composite polymers and joining technologies for reliable and efficient assembly of electronic components
Projekttitel Englisch
NANOJOINING: Novel nano composite polymers and joining technologies for reliable and efficient assembly of electronic components

Texte zu diesem Projekt

 DeutschFranzösischItalienischEnglisch
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Forschungsprogramme
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Kurzbeschreibung
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Partner und Internationale Organisationen
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Abstract
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Datenbankreferenzen
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Erfasste Texte


KategorieText
Schlüsselwörter
(Englisch)
Electrically conductive adhesives; nanotechnology; nano-sised silver particles; silver filled adhesives; flip-chip; underfill; ink-jet dispensing; high resolution conductive adhesives; thermally conductive adhesives;
Economic Aspects; Environmental
Alternative Projektnummern
(Englisch)
EU project number: G1RD-CT-2002-00656
Forschungsprogramme
(Englisch)
EU-programme: 5. Frame Research Programme - 1.3.1 Innovative products, processes and organization
Kurzbeschreibung
(Englisch)
See abstract
Partner und Internationale Organisationen
(Englisch)
Coordinator: Institute of Industrial Technology (NL)
Abstract
(Englisch)
The aim of this project is to develop new materials and processing techniques for bonding and under filling of flip chips and bonding of heat sinks in order to realise a step improvement in flip chip technology and to allow a further minituarisation (in the design) of microelectronic products. The goals are: a reduction of 40% in size, weight, material consumption and power consumption of various products like mobile telecommunication equipment, computers, monitors, controller units for automotive applications, etc. Targeted developments are:
1) new under fill materials containing nano-size fillers with superior properties;
2)new electrically and/or thermally conductive adhesives;
3) a transfer moulding process capable of under filling flip chips in mass volumes (e.g. 200 in one pass) at low costs;
4) an inkjet dispensing technique for electrically and thermally conductive adhesives.
Datenbankreferenzen
(Englisch)
Swiss Database: Euro-DB of the
State Secretariat for Education and Research
Hallwylstrasse 4
CH-3003 Berne, Switzerland
Tel. +41 31 322 74 82
Swiss Project-Number: 01.0575