Résumé des résultats (Abstract)
(Anglais)
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A previous Network of Excellence, GOOD-DIE II, has now been active for nearly two years with membership of over 1000 world-wide covering Europe (approximately two thirds of the members), the USA and the Far East. This activity has had four main tasks: to run workshops on KGD topics in Europe; to produce a newsletter which is distributed to all members; to have working groups on specific KGD topics and to have information pages on the World Wide Web. It is proposed that GOOD-DIE III will continue some of the previous activities together with new ones which are relevant in the current and future die market. The scope of the project will cover all die with and without connection structures such as flip-chip or TAB and minimally-packaged devices (MPD) including CSP, chip-on-foil (COF) etc.
Objectives:
A previous Network of Excellence, GOOD-DIE II, has now been active for nearly two years with membership of over 1000 world-wide covering Europe (approximately two thirds of the members), the USA and the Far East.
This activity has had four main tasks:
to run workshops on KGD topics in Europe;
to produce a newsletter which is distributed to all members;
to have working groups on specific KGD topics and to have information pages on the World Wide Web.
It is proposed that GOOD-DIE III will continue some of the previous activities together with new ones which are relevant in the current and future die market. The scope of the project will cover all die with and without connection structures such as flip-chip or TAB and minimally-packaged devices (MPD) including CSP, chip-on-foil (COF) etc.
Work description:
The activities proposed to be carried out by GOOD-DIE III are:
* to further generate the awareness of the need for disseminating information on KGD and its technology;
* to continue to generate the newsletter for disseminating information on KGD and its technology;
* to create an exchange of KGD/CSP/COF information throughout Europe with cross fertilization to the USA, Japan and the rest of the World;
* to participate in the work of the IEC and CENELEC in generating International and European standards for die devices;
* to continue to assess the handling and delivery methods for KGD/CSP, to contribute to the DPC (Die Product Consortium) Die Handling Manual and to investigate methods of assembly;
* to assess testing and burn-in technologies for KGD/CSP;
* to organise and participate in workshops on KGD in Europe, the Usa and the Far East;
* to organise a second International workshop, CAST 2002;
* to continue to co-operate with other groups such as EPHDP, NETPACK, HD-PUG, DPC etc. who have need for knowledge on KGD/CSP and its associated technologies;
* to disseminate the accessible user experience of HDP manufacture in Europe;
* to co-ordinate the procurement of obsolete die by networking with other groups such as COG and
* to study the use of MEMS devices and their particular handling problems in conjunction with other components by networking with such groups such as FCAG, EMSTO-NEXUS, EPMST, EURIMUS, BSI MEMS working group, ITIC etc.
Milestones:
* Generation of Newsletters, organisation of Workshops and CAST 2002
* Reports on amendments on ES59008 Standard and IEC TC47
* Input report to DPC Die Handling Manual (inc. MEMS) and Die Banking activity for obsolescence
* Novel cost effective defect oriented test technique reports and user experience reports/presentations
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